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t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 1 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? applications 28 - pin 5 x 5mm qfn package ? vsat ? point - to - point radio ? test equipment & sensors product features functional block diagram ? ? C ? C ? ? ? ? ? general description pin configuration the triquint tgc 2510 - sm is a k u - band image reject u p - c onverter with integrated lo buffer amplifier and output variable gain amplifier . the tgc 2510 - sm operates from an rf of 10 to 16 ghz and lo from 6.5 to 1 9 ghz with if inputs from dc to 3.5ghz and is designed using triquints C pin # function label 1, 7, 8, 9, 13, 14, 15, 16, 21, 22, 2 6 , 28 gnd 2 rf out 3, 11, 18, 19, 20 nc 4 vctrl 5 vref 6 vgrf 10 if1 12 if2 17 lo in 23 vglo 24 vdlo 25 vgx 2 7 vdrf ordering i nfo rmation part no. eccn description tgc 2510 - sm ear99 ku - band upc onverter standard t/r size = 500 pieces on a 13 reel. 2510 1249 5343
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 2 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? specifications absolute maximum ratings parameter rating vdrf 6 v vdlo 6 v idrf 350 m a idlo 100 ma vref 3 v vg rf, vglo, vgx - 2 to +1.5 v vctrl 3 v if1, if2 - 2 to +2 v rf input power, 50, t = 25 ? ? ? operation of this device outside the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s operating temp. range - 40 +25 +85 ? v d rf 5 v id rf 240 ma vgrf - 0.70 v vd lo 5 v id lo 60 ma v glo - 0.63 v vref 2 v vgx - 1.2 v vctrl 0 v lo input power 0 6 dbm electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: if input power = - 10 dbm, vgx = - 1.2 v, vref = 2 v, vdlo = 5 v , idlo = 6 0 ma, vdrf = 5 v, idrf = 240 ma, vctrl = 0 v , for max imum gain. parameter conditions min typ max unit s rf frequency range 1 0 16 g hz lo frequency range 6 .5 1 9 g hz if frequency range dc 3.5 ghz lo input power 0 6 dbm conversion gain if=2ghz 15 17 dbm third order output intercept point, oip3 rf = 10 to 11.7ghz, if=2ghz 24 33 dbm third order output intercept point, oip3 rf = 12.7 to 15.4ghz, if=2ghz 26 33 dbm image rejection 25 db p1db output power 22 dbm
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 3 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? specifications thermal and reliability information parameter condition rating thermal resistance, jc , measured to back of package tbase = 85 c jc = 26.1 c/w channel temperature (tch), and median lifetime (tm) tbase = 85 c, v drf = 5 v, i drf = 240 ma vdlo = 5 v , idlo = 60 ma pdiss = 1. 5 w tch = 124 c tm = 2.3 e+ 7 hours channel temperature (tch), and median lifetime (tm) under rf drive tbase = 85 c vdrf = 5 v, idrf = 240 ma vdlo = 5 v , idlo = 85 ma pin = - 10 dbm pdiss = 1.63 w tch = 128 c tm = 1.4 e+ 7 hours
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 4 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idlo = 60 ma, vdrf = 5 v, idrf = 2 4 0 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 20 - 15 - 10 - 5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 20 - 15 - 10 - 5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 5 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. - 20 - 15 - 10 - 5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 20 - 15 - 10 - 5 0 5 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. if vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 6 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idl o = 60 ma, vdrf = 5 v, idrf = 24 0 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 0 dbm, usb, 25 c 10 ghz 13 ghz 16 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 7 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 conversion gain (db) if frequency (ghz) conversion gain vs. if vs. rf vcontrol = 0 v, lo = 6 dbm, usb, 25 c 10 ghz 13 ghz 16 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 8 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idl o = 60 ma, vdrf = 5 v, idrf = 24 0 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 5 10 15 20 25 30 35 40 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output and if input vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - i isolation vs. lo frequency vcontrol = 0 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - i isolation vs. lo frequency vcontrol = 0 v, lsb, 25 c lo = 0 dbm lo = 6 dbm
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 9 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idlo = 60 ma, vdrf = 5 v, idrf = 24 0 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - r isolation vs. lo frequency vcontrol = 0 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - i isolation vs. lo frequency vcontrol = 2 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - r isolation vs. lo frequency vcontrol = 2 v, lsb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - i isolation vs. lo frequency vcontrol = 2 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (dbm) lo frequency (ghz) l - r isolation vs. lo frequency vcontrol = 0 v, usb, 25 c lo = 0 dbm lo = 6 dbm 0 10 20 30 40 50 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) l - r isolation vs. lo frequency vcontrol = 2 v, usb, 25 c lo = 0 dbm lo = 6 dbm
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 10 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 11 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz 0 10 20 30 40 50 60 70 80 10 11 12 13 14 15 16 isolation (db) lo frequency (ghz) i to r isolation vs. lo vs. if vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 0 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 12 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idlo = 60 ma, vdrf = 5 v, idrf = 2 4 0 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied. - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 0 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 6 dbm, usb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 0 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 5 0 5 10 15 10 11 12 13 14 15 16 input 1db compression (dbm) rf frequency (ghz) input 1db compression vs. rf output vcontrol = 2 v, lo = 6 dbm, lsb, 25 c 1.0 ghz 2.0 ghz 3.0 ghz 3.5 ghz - 1 - 0.8 - 0.6 - 0.4 - 0.2 0 0.2 0.4 0.6 0.8 1 10 11 12 13 14 15 16 voltage (v) lo frequency (ghz) nulling voltages vs. lo frequency lo at 3 dbm, if = 2.5 ghz, usb, 25 c vdi_min gain vdi_max gain vdq_min gain vdq_max gain - 1 - 0.8 - 0.6 - 0.4 - 0.2 0 0.2 0.4 0.6 0.8 1 10 11 12 13 14 15 16 voltage (v) lo frequency (ghz) nulling voltages vs. lo frequency lo at 3 dbm, if = 3.5 ghz, usb, 25 c vdi_min gain vdi_max gain vdq_min gain vdq_max gain
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 13 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v , idlo = 60 ma, vdrf = 5 v, idrf = 2 4 0 ma, vgx = - 1.2 v, vref = 2 v data taken with external if hybrid and lo nulling applied. 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c - 40 c if @ 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c - 40 c if @ 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, usb 85 c 25 c - 40 c if @ 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c - 40 c if = 2.0 ghz 0 5 10 15 20 25 10 11 12 13 14 15 16 conversion gain (db) rf frequency (ghz) conversion gain vs. rf vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c - 40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, lsb 85 c 25 c - 40 c if = 2.0 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 14 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, usb 85 c 25 c - 40 c if @ 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 oip3 (dbm) rf frequency (ghz) oip3 vs. rf output vs. temperature vcontrol = 0 v, lo = 6 dbm, lsb 85 c 25 c - 40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c - 40 c if = 2.0 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, lsb 85 c 25 c - 40 c if = 3.5 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c - 40 c if @ 2.0 ghz 0 10 20 30 40 50 10 11 12 13 14 15 16 image rejection ratio (db) rf frequency (ghz) imr vs. rf output vs. temperature vcontrol = 0 v, lo = 0 dbm, usb 85 c 25 c - 40 c if @ 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 15 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? typical performance if input power = - 10 dbm, vdlo = 5 v, idlo = 60 ma, vdrf = 5 v, idrf = 240 ma, vgx = - 1.2 v, vref = 2 v. data taken with external if hybrid and lo nulling applied m x n spurious outputs for l sb lo = 0 C 6 db m, 25 c; all values are in dbc . for lsb if = 2.0 gh z: lo = 12.0 ghz to 18.0 ghz; if = 3.5 ghz: lo = 13.5 ghz to 19.0 ghz. m x n spurious outputs for usb lo = 0 C 6 dbm, 25 c; all values are in dbc. for u sb if = 2.0 gh z : lo = 8.0 ghz to 14.0 ghz; if = 3.5 ghz: lo = 6.5 ghz to 12.5 ghz. rf/lo 0 1 2 3 -3 --- 70 79 76 -2 --- 44 40 75 -1 --- 0 38 69 0 --- 24 30 38 1 61 24 69 68 2 62 44 79 75 3 72 78 78 76 spurious suppresion (dbc) for if = 2.0 ghz rf/lo 0 1 2 3 -3 --- 84 75 73 -2 --- 50 45 71 -1 --- 0 59 63 0 --- 21 28 34 1 51 27 64 69 2 49 64 74 74 3 85 77 70 --- spurious suppresion (dbc) for if = 3.5 ghz rf/lo 0 1 2 3 -3 --- 70 46 44 -2 --- 46 29 54 -1 --- 17 20 15 0 --- 23 -17 25 1 56 0 8 26 2 28 33 32 62 3 48 43 66 71 spurious suppresion (dbc) for if = 2.0 ghz rf/lo 0 1 2 3 -3 --- 62 66 49 -2 --- 70 33 41 -1 --- 23 8 14 0 --- 19 -29 -17 1 23 0 4 11 2 27 30 38 41 3 56 58 64 72 spurious suppresion (dbc) for if = 3.5 ghz
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 16 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? pin description top view pin symbol description 1, 7, 8, 9, 13, 14, 15, 16, 21, 22, 2 6 , 28 gnd internal grounding; must be grounded on pcb. 2 rf out rf output matched to 50 ohms, ac coupled. 3, 11, 18, 19, 20 nc no internal connection; must be grounded on pcb. 4 vctrl control voltage. bias network is required; see application circuit on page 17 as an example. 5 vref reference voltage. bias network is required; see application circuit on page 17 as an example. 6 vgrf rf gate voltage. bias network is required; see application circuit on page 17 as an example. 10 if1 i f input matched to 50 ohms, dc c oupled. 12 if2 if inp ut matched to 50 ohms, dc c oupled. 17 lo in lo input, matched to 50 ohms, ac c oupled. 23 vglo lo gate voltage. bias network is required; see application circuit on page 17 as an example. 24 vdlo lo drain voltage. bias network is required; see application circuit on page 17 as an example. 25 vgx mixer voltage. bias network is required; see application circuit on page 17 as an example. 2 7 vdrf rf drain voltage. bias network is required; see application circuit on page 17 as an example. 29 gnd backside paddle. multiple vias should be employed to minimize induct ance and thermal resistance; see mounting configuration on page 20 for suggested footprint.
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 17 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit biasing procedures bias up bias down set vgx to - 1. 2 v turn of f rf signal set v ref to 2.0 v reduce vd lo to 0 v set v ctrl to 0 v reduce vd rf to 0 v set v glo to - 1.5 v set v di to 0 v , if used for lo nulling set vdlo to 5.0 v set vdq to 0 v , if used for lo nulling increase vg lo to get id lo = 6 0 ma reduce vg lo to 0 v set vgrf to - 1.5 v reduce vgrf to 0 v set vdrf to 5 .0 v reduce vref to 0 v increase vg rf to get id rf = 240 ma reduce vctrl to 0 v set vdi, vdq to 0 v; or no connection reduce vgx to 0 v apply rf signal vgrf lo input if input 2510 yyww xxxx rf output vref vctrl vdi vdq vglo vdlo vdrf vgx if input usb lsb
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 18 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit pc board layout board material is ro4003 0.008 thick ness with ? oz copper cladding. for further technical information, refer to the tgc2510 - sm product information page . q1
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 19 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? application circuit bill of material ref des value description manufacturer part number c1 C C C C C l sb configuration ref des value description manufacturer part number x1 power splitter mini - circuits qcn - 4 5+ r1 0 50 u sb configuration ref des value description manufacturer part number x1 power splitter mini - circuits qcn - 2 5+ r 2 0 50
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 20 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? mechanical information package information and dimensions all dimensions are in millimeters. the tgc2510 - sm will be marked with the 2510 designator and a lot code marked below the part designator. the yy represents the last two digits of the year the part was manufactured, the ww is the work week, and the xxxx is an auto - generated number . this package is lead - free/rohs - compliant with a copper alloy base (cda194), and the plating m aterial on the leads is nipdau. it is compatible with a lead - free (maximum 260 c reflow temperature) soldering process .
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 21 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? mechani cal information pcb mounting pattern all dimensions are in millimeters . notes: 1. the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommen ded. 2. ground / thermal vias are critical for the proper performance of this device. vias sh ould use a .35mm diameter drill and have a final plated thru diameter of .25 mm . tape and reel information tape and reel specifications for this part are also available on the triquint website in the application notes section. standard t/r size = 500 pieces on a 13 reel . material cavity (mm) distance between centerline (mm) carrier tape (mm) cover tape (mm) vendor vendor p/n length (a0) width (b0) depth (k0) pitch (p1) length direction (p2) width direction (f) width (w) width (w) advantek bcc5x5 - b 5. 25 5.25 1. 8 8.0 2.00 5.50 12.0 9.20
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 22 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? product compliance information esd information esd rating: class 0 value: passes ? solderability compatible with lead - free ( 260 c max imum reflow temp erature) soldering processes . package lead plating: nipdau the use of no - clean solder to avoid washing after soldering is recommended . th is package is not compatible with solder containing lead . roh s compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? ? ? ? 15 h 12 br 4 0 2 ) free ? ? msl rating moisture sensitivity level (msl) 1 at 260c convection reflow per jedec standard ipc/jedec j - std - 020. recommended soldering temperature profile
t gc2510 - sm ku - band upconverter data sheet: rev e 8 - 13 - 14 - 23 of 23 - disclaimer: subject to change without notice ? 20 14 triquint semiconductor, inc. connecting the digital world to the global network ? contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1. 972.994.8465 email: info - sales@tqs.com fax: +1. 972 .994.8504 for technical questions and application information: email: info - networks@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contain ed herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibil ity or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all informati on contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, expli citly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.

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